MATERIALS FOR BOXES AND PALLETS

Injection molded boxes, stacking bins, shelf bins, and picking bins made of PRE-ELEC^® materials can be used for rigid ESD packaging for storing and transporting electronic components. Boxes can be lined with electrically conductive foams and divided into compartments with electrically conductive sheets.

We have available polypropylene grades that contain 30% recycled material, a recent requirement from the automotive industry. The materials maintain the high-level mechanical properties needed for this application.

Injection molded pallets made out of PRE-ELEC^® materials can be used for ESD component transportation and storage, as well as ATEX areas.

Semiconductor components are manufactured using the world's most automated and technologically advanced processes. From the perspective of wafer processing, each critical transportation and process step requires unique materials, designs, and wafer carriers. The calculation results indicate that even if the yield is only increased by 1%, the net profit of component manufacturers may increase by $100 million.

Wafer carrier materials need to be electrically conductive to protect from ESD and dust, wear-resistant, and have dimensional stability. They must be reusable and recyclable.